Semiconductors · Houston, Texas · Formation stage
HEXAspec
Specializes in manufacturing high-performance packaging fillers, ensuring precise quality control and offering customizable shapes to meet diverse needs
Review noteRice spinout still on grants and prizes: $100K Rice One Small Step grant and a $500K NSF Partnership for Innovation grant reported Jun 4, 2025; no equity round found. Source ↗
Edge
17#100 · ▼12 in 7d
1 of 8 families
People
- Tianshu ZhaiSearch ↗
Principal investigator, NSF SBIR Fast-Track
Score
Momentum24
Capital
Thesis fit96
× 0.97
Matched on additive manufacturing, advanced packaging, aerospace, chip, chip packaging
Earliness100
× 1.00
Almost no public footprint
Team–
× 0.85
1 named person, none from a top lab or company
24 × 0.97 × 1.00 × 0.85 × 0.85 one family only = 17